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中文English

Turnkey Solution

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Turnkey Solution

DRAM 

DDR2 / DDR3 / DDR4 / DDR5 / LP2 / LP4 / LP5
  
 Burn in; Core; Speed; Module

NAND 

SSD / Micro SD / U-Disk / CF Card / UDP/ eMMC
   
Burn in; Core; Speed; Module

Function IC 

   FCCSP / FCBGA / Hybrid FCCSP + MUF
   Digital; Wireless/RF;  SoC; Power/Analog

Package Design

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Package Design

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  AutoCAD 

 • Lead frame design
 • Bonding diagram generation
 • POD Drawing creation etc.

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 Cadence APD 

 • Substrate routing

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 Ansys Icepak 

 • Junction to ambient thermal resistance
 • Junction to board thermal resistance 
 • Junction to case thermal resistance

Package Design

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Package Design

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     (Strategic Partnership)
TJS have a strategic partnering relationship with Jiangsu Nepes.
We leverages each respective expertise to jointly develop and market technologies for Flipchip turnkey solution.

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• 8“ Gold Bump(including COG/COF)

• 8“ Solder Bump/WLCSP, Copper Pillar Bump、RDL
• 12"CopperPillar Bump 
• CP/F & Backend Full Turnkey Service