中文English
中文English

Package List

TITLE

Package List

  • DDR2
  • DDR3
  • DDR4
  • LPDDR
  • eMMC/MCP
  • NAND
  • LOGIC

Package Type

Package Size
Ball/Lead Pitch
Ball Size

60B wBGA

8x10x1.2(Max.)

0.8mm

0.45mm

8x10.5x1.2(Max.)

0.8mm

0.45mm

9x11.5x1.2(Max.)

0.8mm

0.45mm

84B wBGA

8x12.5x1.2(Max.)

0.8mm

0.45mm


Package TypePackage SizeBall SizeBall/Lead pitch

78B wBGA

7.5x11x1.2(Max.)

0.45mm

0.8mm

8x10.5x1.2(Max.)

0.45mm

0.8mm

9x10.5x1.2(Max.)

0.45mm

0.8mm

9x11.1X1.2(Max.)

0.45mm

0.8mm

9.4x11.1X1.2(Max.)

0.45mm

0.8mm

10.5x12x1.2(Max.)

0.45mm

0.8mm

78B FCBGA

9x10.5x1.2(Max.)

0.45mm

0.8mm

96B wBGA

9x13x1.2(Max.)

0.45mm

0.8mm


Package Type

Package Size

Ball Size

Ball/Lead pitch

78B wBGA

8x12x1.2(Max.)

0.45mm

0.8mm

9x10.5x1.2(Max.)

0.45mm

0.8mm

78B wBGA

9x13x1.2(Max.)

0.45mm

0.8mm

9x14x1.2(Max.)

0.45mm

0.8mm


Product Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

LPDDR2

162B FBGA

12x12x1.1(Max.)

0.3/0.35mm

0.5mm

LPDDR4

200B FBGA

10x14.5x0.85(Max.)

0.3mm

0.8x0.65mm


Product TypePackage TypePackage SizeBall SizeBall/Lead pitch

eMMC

153B FBGA

11.5x13x1.0(Max.)

0.3mm

0.5mm

MCP

162B FBGA

11.5x13x1.0(Max.)

0.3mm

0.5mm

9x11.5x1.0(Max.)

0.3mm

0.5mm

8x10.5x1.0(Max.)

0.3mm

0.5mm

11.5x13x1.0(Max.)

0.3mm

0.5mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

NAND

48 TSOP

12x18.4x1.0mm

-

0.5mm

63B FBGA

10.5x13x1.0mm

0.45mm

0.8mm

132B FBGA

12x18x1.1mm

0.45mm

1.0mm

12x18x1.4mm

13x18x1.1mm

13x18x1.4mm

152B FBGA

14x18x1.0mm

0.45mm

1.0mm

14x18x1.4mm

272B FBGA

14x18x1.4mm

0.45mm

0.8mm

UDP

11.3x24.8x1.4mm

-

-

Micro SD

11x15x1.1mm

-

-

Nano Memory

8.8x12.3x0.78mm

-

-

SIP - USB

11.1x16x1.11mm

-

-

11.1x18x1.11mm



Product TypePackage TypePackage SizeBall SizeBall/Lead pitch

Logic

130B FBGA

8x9x1.0/1.05(Max.)

0.30mm

0.65mm

144B FBGA

10x10x1.2(Max.)

0.35mm

0.80mm

324B FCCSP

15x15x2.0(Max.)

0.45mm

0.80mm

484B FCCSP

19x19x2.0(Max.)

0.45mm

0.80mm


Test Platform

TITLE

Test Platform

  • DRAM
  • NAND
  • DIMM
  • LOGIC


image.png

image.png

  T5831 - 1.2Gbps


       image.png   UNI-480                      image.png  HT3309


        5eeed4342684b.png                  5eeed52a21d5a.png

image.png


            image.png
        V93000 

          Testing capabilities for RF and mixed-signal ICs

             -> PS1600 @ 1600Mbps 
             -> RF solutions


Advantages

TITLE

Advantages

  • High Stacking
  • Test Solution
  • 2D Marking


With SDBG process, high accuracy die bonder and compression mold, 
TJS has full capability to provide the high stacking solutions.  


8D

16D

5eee16312e65c.png

5eee163e98522.png

5eee164e523cf.png5eee165668dc6.png



TJS's professional Test R&D Team focus on program development, hardware design and automated integration, etc.
 Program Coding 
 Hardware Design  ->  
Burn-In Board | Hifix/DSA | LoadBoard | Socket | Change Kit

③ Automation Integration


Test Platform

5eeea9be46352.png
     5eeeac1202460.png            5eeeac60cd7b4.png




image.png

Package Roadmap

TITLE

Package Roadmap

  • Memory IC
  • Function IC
  • Bumping

图片.png

 5eee0a7f330f1.png

图片.png
图片.png