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中文English
ABOUT US

Turnkey Solution

ABOUT US

Turnkey Solution

DRAM 

DDR2 / DDR3 / DDR4 / DDR5 / LP2 / LP4 / LP5
 
 Burn in; Core; Speed; Module



NAND 

SSD / Micro SD / U-Disk / CF Card / UDP/ eMMC
   
Burn in; Core; Speed; Module



Function IC 

   FCCSP / FCBGA / Hybrid FCCSP + MUF
   Digital; Wireless/RF;  SoC; Power/Analog



Package Design

DRAM,NAND,Function IC

Package Design

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  AutoCAD 

 • Lead frame design
 • Bonding diagram generation
 • POD Drawing creation etc.

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 Cadence APD 

 • Substrate routing

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 Ansys Icepak 

 • Junction to ambient thermal resistance
 • Junction to board thermal resistance 
 • Junction to case thermal resistance

Bump Service

Bump Service

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TJS have a strategic partnering relationship with Jiangsu Nepes.
We leverages
each respective expertise to jointly develop and market technologies for Flipchip turnkey solution.

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• 8“ Gold Bump(including COG/COF)

• 8“ Solder Bump/WLCSP, Copper Pillar Bump、RDL
• 12"CopperPillar Bump 
• CP/F & Backend Full Turnkey Service