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Package List

DRAM,NAND,Function IC

Package List

  • DDR2
  • DDR3
  • DDR4
  • LPDDR
  • NAND
  • eMMC/MCP
  • LOGIC

Product   Type

Package   Type

Package   Size

Ball   Size

Ball/Lead   pitch

DDR2

60B wBGA

8x10x1.2(Max.)

0.45mm

0.8mm

8x10.5x1.2(Max.)

9x11.5x1.2(Max.)

84B wBGA

8x12.5x1.2(Max.)

0.45mm

0.8mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

DDR3

78B wBGA

7.5x11x1.2mm

0.45mm

0.8mm

8x10.5x1.2mm

9x10.5x1.2mm

9x11.1X1.2mm

9.4x11.1X1.2mm

10.5x12x1.2mm

96B wBGA

9x13x1.2mm

0.45mm

0.8mm

78B FCBGA

9x10.5x1.2mm

0.45mm

0.8mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

DDR4

78B wBGA

8x12x1.2mm

0.45mm

0.8mm

9x10.5x1.2mm

96B wBGA

9x13x1.2mm

0.45mm

0.8mm

9x14x1.2mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

LPDDR2,4

162B FBGA

12x12x0.95mm

0.3mm

0.5mm

12x12x1.1mm

200B FBGA

10x14.5x0.85mm

0.3mm

0.65mm

10x14.5x1.1mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

NAND

48 TSOP

12x18.4x1.0mm

-

0.5mm

63B FBGA

10.5x13x1.0mm

0.45mm

0.8mm

132B FBGA

12x18x1.1mm

0.45mm

1.0mm

12x18x1.4mm

13x18x1.1mm

13x18x1.4mm

152B FBGA

14x18x1.0mm

0.45mm

1.0mm

14x18x1.4mm

272B FBGA

14x18x1.4mm

0.45mm

0.8mm

UDP

11.3x24.8x1.4mm

-

-

Micro SD

11x15x1.1mm

-

-

Nano Memory

8.8x12.3x0.78mm

-

-

SIP - USB

11.1x16x1.11mm

-

-

11.1x18x1.11mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

eMMC

153B FBGA

11.5x13x1.0mm

0.3mm

0.5mm

MCP

162B FBGA

9x11.5x1.0mm

0.3mm

0.5mm

8x10.5x1.0mm

0.3mm

0.5mm

11.5x13x1.0mm

0.3mm

0.5mm


Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

Logic

130B FBGA

8x9x1.0/1.05mm

0.3mm

0.65mm

144B FBGA

10x10x1.2mm

0.35mm

0.8mm

324B FCCSP

15x15x2.0mm

0.45mm

0.8mm

484B FCCSP

19x19x2.0mm

0.45mm

0.8mm


Test Platform

Burn In,Function,Speed,SLT

Test Platform

  • DRAM
  • NAND
  • DIMM,SLT
  • LOGIC IC


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  T5831 - 1.2Gbps
 


       image.png   UNI-480                      image.png  HT3309


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        V93000 

          Testing capabilities for RF and mixed-signal ICs

             -> PS1600 @ 1600Mbps
             -> RF solutions


Advantages

DRAM,NAND,Function IC

Advantages

  • High Stacking
  • Test Solution
  • 2D Marking


With SDBG process, high accuracy die bonder and compression mold,
TJS has full capability to provide the high stacking solutions.  


8D

                                                                  16D

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TJS's professional Test R&D Team focus on program development, hardware design and automated integration, etc.
Program Coding
Hardware Design  -> 
Burn-In Board | Hifix/DSA | LoadBoard | Socket | Change Kit

Automation Integration


Test Platform

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TJS has 2D marking system fully support the traceability.

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Package Roadmap

DRAM,NAND,Function IC

Package Roadmap

  • Memory IC
  • Function IC
  • Bumping


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